Veranstaltung  /  3.12.2018  -  7.12.2018

Der ESE Kongress – Deutschlands größter Kongress für professionelles Embedded Software Engineering

Embedded Software Engineering gehört zu den großen Herausforderungen der modernen Elektronikentwicklung. Nur mit einer planvollen, ingenieurmäßigen Herangehensweise und modernen Methoden der Informatik und Elektronikentwicklung lassen sich die durch Komplexität sowie Zeit- und Kostendruck steigenden Anforderungen künftig beherrschen.

Wo technische Systeme schneller, effektiver, intelligenter, kommunikativer, sicherer oder ergonomischer werden, liefert das Embedded Software Engineering wesentliche Erfolgsbausteine.

Der Embedded Software Engineering Kongress unterstützt Sie dabei, Ihren Lösungsweg
zu finden und die Weichen für die Zukunft rechtzeitig zu stellen.

Auch das Fraunhofer IESE ist mit einem Vortrag am 05.12.2018 um 11:45 Uhr dabei:

Continuous Systems Integration with Virtual Spaces ( Vortrag )

Architecting for Continuous Software Engineering

Continuous software engineering aims at orchestrating engineering knowledge from various disciplines in order to deal with the rapid changes within the ecosystems of which software-based systems are a part. The literature claims that one means for ensuring these prompt responses is to incorporate virtual prototypes of the system into the development process as early as possible, such that requirements and architecture decisions are verified early and continuously by means of simulations. Despite the maturity of practices for designing and assessing architectures by means of simulations, there is still a lack of platforms that would enable both the design and simulation of architecture drivers and solutions in a continuous engineering context. In this paper we therefore present the Fraunhofer Virtual Space for Continuous Engineering, which is a web-based platform that enables (i) model- and text-based architecture specification (drivers and design), (ii) continuous simulation of architecture solutions against architecture drivers, and (iii) continuous analysis of the integration and consistency of engineering artifacts.

Dr. Pablo Oliveira Antonino, Fraunhofer IESE

Weitere Informationen zu dieser Veranstaltung finden Sie hier.